ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,949, issued on April 7, was assigned to NHK SPRING Co. LTD. (Yokohama, Japan). "Stage and method of manufacturing stage" was invented by To... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,950, issued on April 7, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan). "Electrostatic chuck heater and film deposition apparatus" was... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,951, issued on April 7, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan). "Wafer placement table" was invented by Taro Usami (Kasamatsu-... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,952, issued on April 7, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan). "Member for semiconductor manufacturing apparatus" was invente... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,953, issued on April 7, was assigned to DISCO Corp. (Tokyo). "Protective member forming apparatus and method of forming protective member" ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,954, issued on April 7, was assigned to Oki Electric Industry Co. Ltd. (Tokyo). "Electronic structure and method of manufacturing the same"... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,955, issued on April 7, was assigned to EUGENE TECHNOLOGY Co. LTD. (South Korea). "Substrate transfer device and substrate processing appar... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,956, issued on April 7, was assigned to SUMCO Corp. (Tokyo). "Vapor deposition device and vapor deposition method" was invented by Yu Minam... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,957, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate transfer apparatus and substrate transfer method" was inven... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,958, issued on April 7, was assigned to NISSAN CHEMICAL Corp. (Tokyo). "Wafer treatment method" was invented by Tomoya Ohashi (Toyama, Japa... Read More